SMTA Capital Chapter to Host Chapter Tutorial Program


Reading time ( words)

The SMTA Capital Chapter will host a Chapter Tutorial Program on March 15 from 9 am to 3 pm in Rockville, Maryland. Phil Zarrow, ITM Consulting, will present "Understanding and Implementing Best Practices in Electronic Assembly Processes".

You have the responsibility and resources to improve the productivity of an assembly operation….what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

Topics will cover best practices for the following processes: assembly, solder paste printing, pick and place, reflow soldering, wave soldering, selective soldering, and cleaning vs No-Clean considerations. The event will conclude with a Q&A session with the presenter.

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.

Location:

Best Western Plus Hotel & Suites
1251 W Montgomery Ave
Rockville, MD 20850

Please join us for this learning and networking event. The registration fees are $200 for members, $295 for non-members, $50 for student chapter members, and $70 for student-non chapter members. A one-year Individual or Student SMTA Membership is included in the $295 or $70 non-member prices. Registration deadline is March 1st.To RSVP, click here.

About Phil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

About SMTA: 30 Years Developing Solutions in Electronics Assembly

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. 

About Zentech

Zentech Manufacturing, Inc. is a privately held, engineering-driven contract manufacturer specializing in the design and manufacture of highly-complex electronic and RF circuit cards and assemblies.The company has facilities in Baltimore, MD (headquarters) and Fredericksburg, Va. and maintains several key certifications, including ISO 9001:2008, ITAR (US State Dept.), AS9100 (aerospace), and ISO 13485 (medical). In addition, Zentech is a certified IPC Trusted Source supplier for Class 3 mission-critical electronics, and the company is IPC J-STD-001 Space Addendum QML certified.

Share

Print


Suggested Items

Award-winning Koh Young Process Optimizer

02/18/2019 | Dan Beaulieu
Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.



Copyright © 2019 I-Connect007. All rights reserved.