MacDermid Enthone Electronics Solutions to Exhibit at 2018 IMAPS Device Packaging Show


Reading time ( words)

MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2018.

MacDermid Enthone‘s Advanced Electronics Solutions (AES) business is a global leader in high performance semiconductor chemistries and assembly materials. OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the IMAPS booth to collaboratively develop solutions that meet the fast paced semiconductor market demands. The AES team will highlight the MICROFAB family of products which provides advanced packaging solutions that exceed aggressive packaging design requirements and enable greater device reliability. MEES will showcase its chemical processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter.

Eric Gongora, General Manager and Stretegic Marketing Director of Wafer Level Packaging, along with AES industry experts, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.

The booth will also include specialty product offerings from their sister company, Alpha Advanced Materials. The combined technology, experience and product offerings make them the new industry leader in all materials for Advanced Packaging.

For more information on our latest product technologies, visit us at Booth 45/46.

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.

Share

Print


Suggested Items

IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?

01/31/2019 | I-Connect007
On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.

Better to Light a Candle: Chapter One—Prepping the Next Generation

01/08/2019 | Marc Carter, Independent Contributor
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

MacDermid Enthone Discusses Consolidation Benefits

01/08/2019 | Pete Starkey, I-Connect007
At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.



Copyright © 2019 I-Connect007. All rights reserved.