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Panasonic’s high-speed, low-loss laminate system, MEGTRON 6, has been selected by IBM for use in the company’s new z14 mainframe computers. Launched in July of this year, the z14 is IBM’s latest mainframe computer, which comprises the world’s fastest microprocessor, with clock-speed at 5.2 GHz. The new IBM z14 mainframe is the core of trusted digital experiences. It enables the protection of data via pervasive encryption. The z14 is designed to be open and connected in the cloud, enabling massive transaction scale of high volume encrypted workloads at low cost.
MEGTRON 6 (R-5775) is designed specifically for such high-speed network equipment and high-frequency measuring instruments. MEGTRON 6 is a woven glass-reinforced laminate system which possesses the PCB industry’s highest combined performance characteristics of Dk 3.5, Df .002 and Td 410°C.
For more information on Panasonic’s MEGTRON 6, click here.
For more information on IBM’s z14 Mainframe, click here.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People,” Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily.
I-Connect007 Editorial Team
For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.
Patty Goldman, I-Connect007
This month, Mike Carano’s “Trouble in Your Tank” column on troubleshooting PTH failure mechanisms fit well with our wet processing topic. We hope you benefit from his practical knowledge and are storing his columns for future reference! Our final column this month comes from Elmatica’s Didrick Beck. The subject is Lean manufacturing and the differences between standard and non-standard product lines. Good information to know.
Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.