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With their customary flair for finding a suitable venue for their conferences, EIPC has been invited by Alstom Transport Information Solutions in Villeurbanne, France to host their Winter event to be held on February 1-2, 2018.
The bonus programme will be a guided tour at the Alstom facility, a global player fully focused on transport.
As a promoter of sustainable mobility, Alstom develops and markets systems, equipment and services for the transport sector. Alstom offers a complete range of solutions (from high-speed trains to metros, tramways and e-buses), passenger solutions, customized services (maintenance, modernization), infrastructure, signaling and digital mobility solutions.
The popular network dinner on Thursday, February 1, will take place in the city center of Lyon at Brasserie Georges.
Updated conference programme is available here.
Nolan Johnson and Barry Matties, I-Connect007
During PCB West 2018, Nolan Johnson and Barry Matties sat down with Jeff Waters, Isola CEO, to catch up on company activities, including the recent sale of the factory in Chandler, Arizona, the plan to build a new facility, product developments, current market dynamics, a new CFO, and much more.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Dan Beaulieu checked in with HSIO Technologies President James Rathburn recently to see what he and his team are up to and learned how they are using liquid crystal polymers and other materials to focus on increasing high-speed and high-density PCBs for uses in all markets.