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The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show), to be held from December 6–8, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will feature leading industry experts sharing their insights on the latest market trends and innovations.
Topics to be discussed include advancing HDI technology, mobile intelligent telecommunications, PCB production for the automotive industry, smart manufacturing for PCB production, cleaning PCB / PCBA flux residual process, and conformal coating trends, among others.
Click here to view the full agenda.
11/29/2018 | Happy Holden, I-Connect007
Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.
10/09/2018 | Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
08/31/2018 | Sam Sangani, PNC Inc.
A popular definition of reliability is “The quality of being trustworthy or of performing consistently well.” Upfront engineering is of utmost importance in developing a design that will endure its intended life cycle. On the other hand, the manufacturing of that design is just as critical.