EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Program Available Now! EIPC Winter Conference Lyon 2018

- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence

News from China

- Schweizer Sets Direction for Further Growth by Investing in China

- Advanced Electronics Needs Met in China

News from France

- Protecno Becomes the First French PCB Manufacturer to Invest in Orbotech's Nuvogo Direct Imaging Solution

News from productronica

- productronica Sets Standards in Electronics Production

News from the UK

- IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group

- iMaps UK Conference

- Microtech 2018

- Advanced Packaging Conference: November 14–15, 2017 in Munich

- ICT Evening Seminar, December 5

- BGA, QFN Fine Pitch Rework Experience Live, November 21


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03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

A Plug-in that Connects CAD Software to 3D Printer

03/13/2018 | Dan Feinberg
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

RTW IPC APEX EXPO: Annual Update for IPC Validation Services

03/06/2018 | Real Time with...IPC
Randy Cherry, director of validation services, provides an annual update for IPC validation services, including QML and QPL supplier listings.

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