Heraeus Electronics and Mozaik Technology Ventures Sign Global Licensing Agreement for Photoimageable Thick Film Technologies


Reading time ( words)

Heraeus Electronics has announced a global licensing agreement with Mozaik Technology Ventures Limited, an industry leader in super fine thick film technology. Under the terms of the agreement, Heraeus Electronics will license a broad range of Mozaik’s photoimageable thick film paste technology.

Picture: Dr. Frank Stietz, President Heraeus Electronics und Steve Muckett, Gründer and Managing Director von Mozaik Technology Ventures sign global licensing agreement

The partnership with Mozaik will enable Heraeus to enhance its market-leading solution portfolio for customers who manufacture high-profile electronics, such as sensors, 5G high frequency communication circuits, smaller passive electronic components and touch panel displays. With the continued market trend toward smaller and finer electronics elements, advanced materials and the process technology to create them become increasingly critical requirements. The Mozaik photoimageable technology will be used to create a platform of thick film pastes such as silver, silver-platinum, silver-palladium, gold, platinum conductors and ceramic/glass insulators for these specific application areas.

According to Frank Stietz, president of Heraeus Electronics, “We have seen a market trend in thick film materials toward smaller features, such as conductors for finer lines and spaces. The industry will need to meet the demand and requirements for electronic component miniaturization and higher density microelectronic circuits. Mozaik’s product lines and technologies will enable us to set new standards in electronics capabilities and performance for our customers.”

Heraeus Electronics expects that by using photoimageable thick film pastes, its customers can build electronic components and circuits with lines and spaces (l/s) below 50 microns in size (demonstrated l/s already at 25 microns).  The current state-of-the-art feature size with standard thick film inks is 75 microns under optimized and highly engineered conditions.  In actual, practical manufacturing settings, most devices are built with 100 to 150 microns on an industrial scale.

Steve Muckett, the founder and Managing Director of Mozaik Technology Ventures, added, “We are pleased to partner with Heraeus Electronics because they are a strong and reliable supplier of electronic materials with a global reach. With Heraeus using our fine line capable pastes, it will drive benefits and innovation across our industry. We anticipate that many manufacturers of ceramic based circuits and components will be able to introduce low-cost and very fine resolution parts, which the market needs.”

About Heraeus

Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned company formed in 1851. With expertise, a focus on innovations, operational excellence and an entrepreneurial leadership, we strive to continuously improve the businesses of our customers around the world. We create high-quality solutions for our customers and strengthen their long-term competitiveness by combining material expertise with technological know-how. Our ideas are focused on important issues such as the environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries.

In the 2016 financial year, Heraeus generated revenues without precious metals of €2.0 bn and a total revenue of €21.5 bn. With approximately 12,400 employees worldwide in more than 100 subsidiaries in 40 countries, Heraeus holds a leading position in its global markets.

In 2016, the Foundation for Family Businesses named Heraeus as one of the “Top 10 Family Businesses” in Germany.

Share


Suggested Items

The Benefits of Coming Together to Form a Global Reach

01/16/2018 | Patty Goldman, I-Connect007
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.

It’s a Long, Winding and Exciting Road for Automotive Electronics

01/12/2018 | Patty Goldman, I-Connect007
It was truly a delight to talk with Alun Morgan at productronica this year. He may be the most enthusiastic person in the field of electronics that I have ever met, as you will certainly understand as you read this interview.

Getting the Heat Out

01/12/2018 | Patty Goldman, I-Connect007
Increasing consumer demands for high performance and the need for high reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing.



Copyright © 2018 I-Connect007. All rights reserved.