FTG Circuits Invests in Additional Orbotech DI and AOI Solutions

Reading time ( words)

Orbotech Ltd. announced today that FTG (Firan Technology Group) Circuits has updated and expanded the PCB production capacity in their Toronto, Ontario facility with new DI (Direct Imaging) and AOI (Automated Optical Inspection) solutions from Orbotech.

FTG Circuits, a manufacturer of high technology, high reliability printed circuit boards, is implementing Orbotech’s Nuvogo™ 1000 DI solution and its Fusion™ 20 AOI solutions in Toronto. FTG has added these solutions to their existing base of Orbotech PCB production systems which includes existing DI systems in both Toronto and Chatsworth California as well as Fusion 20 AOI equipment in Chatsworth California to upgrade their technical capabilities to meet the needs of their customers’ roadmaps as well as the requirements of the market.

“Orbotech’s technologically-advanced solutions and customer support have always allowed us to get more out of our production line, both from a quality and a cost-efficiency perspective,” said Brad Bourne, CEO of FTG Corporation. “As a result of our consistently positive experience, Orbotech was the obvious choice when we decided to upgrade and expand our DI and AOI capacity.”

“FTG Circuits is one of North America’s leading PCB manufacturers for the aerospace and defense industries,” said Sharon Cohen, President of Orbotech West. “We are delighted that FTG Circuits continue to choose Orbotech’s industry leading DI and AOI solutions in this increasingly competitive market, and that our solutions continue to help them meet the uniquely rigorous quality requirements of their customers.”

About Nuvogo 1000

Nuvogo 1000 is a member of the Orbotech Nuvogo family of industry-leading Direct Imaging (DI) solutions. Utilizing a high-power laser and unique MultiWave Laser Technology™, the Nuvogo 1000 provides maximum flexibility on a wide range of materials and applications. Incorporating Orbotech’s field-proven Large Scan Optics (LSO) Technology™ with its high depth-of-focus, the Nuvogo 1000 is a perfect match for patterning and solder mask applications that demand fine structures on variating topography. This powerful system is designed for fast throughput while maintaining optimal quality.

About Fusion 20

Fusion 20 is Orbotech's innovative AOI solution that delivers a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion 20 inspects each panel with multiple light sources in one scan for unparalleled detection accuracy. Designed for high-end HDI and MLB applications, Fusion re-defines PCB production efficiency, while achieving lowest cost per scan.

About Firan Technology Group Corporation

FTG is an aerospace and defense electronics product and subsystem supplier to customers around the globe. FTG has two operating units:

FTG Circuits is a manufacturer of high technology, high reliability printed circuit boards. Our customers are leaders in the aviation, defense, and high technology industries. FTG Circuits has operations in Toronto, Ontario, Chatsworth, California, Hudson, New Hampshire and a joint venture in Tianjin, China.

FTG Aerospace manufactures illuminated cockpit panels, keyboards and sub-assemblies for original equipment manufacturers of aerospace and defense equipment. FTG Aerospace has operations in Toronto, Ontario, Chatsworth, California, Fort Worth, Texas and Tianjin, China.

The Corporation's shares are traded on the Toronto Stock Exchange under the symbol FTG.

About Orbotech Ltd.

Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality (‘reading’); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces (‘writing’); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing (‘connecting’). Orbotech refers to this ‘reading’, ‘writing’ and ‘connecting’ as enabling the ‘Language of Electronics’. For more information, visit www.orbotech.com and www.spts.com.


Suggested Items

A Plug-in that Connects CAD Software to 3D Printer

03/13/2018 | Dan Feinberg
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/21/2018 | Pete Starkey, I-Connect007
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/20/2018 | Pete Starkey, I-Connect007
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

Copyright © 2018 I-Connect007. All rights reserved.