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MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will exhibit at the TPCA tradeshow and present two technical papers at the IMPACT 2017 Conference, co-located with TPCA in Taipei, October 25-27, 2017.
MacDermid Enthone has invested in the research of innovative processes and product designs to meet the demanding standards of an ever shrinking circuit board. Kesheng Feng PhD, Director of Research, Metallization, will be presenting “Innovative Acid Copper Process for Simultaneously Filling Vias and Plating Through Holes“ October 25, 4:20PM, followed by “Copper Pillar Plating Systems, High-Speed-Low Heat“ at 5:20PM. Both papers will be in Session S8, Room 503.
MacDermid Enthone Process Specialists will be on hand to discuss the chemistries and materials we offer throughout the entire electronics supply chain. Showcased will be ENTEK PLUS HT, the most widely used and trsuted OSP on the market, the next generation Affinity ENIG 2.0 – a high reliability electroless nickel immersion gold process, and our cost effective Modified Semi-Additive Process “MSAP“ which has become a PCB industry focus. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Learn more at the MacDermid Enthone Electronics Solutions booth #K1013.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics