Performance Evaluation of Thin-Film Embedded Resistors


Reading time ( words)

Thin-film microstrip circuits have been widely applied in microwave communications, electronic countermeasures (ECM), and aerospace applications, etc. When manufacturing thin-film ICs, it is very important to apply deposited thin-film resistor material to fabricate high-accuracy and highly stable thin-film embedded resistors. Thin-film ICs call for thin-film resistors that meet these stringent requirements:

  1. Square resistance should be wide enough
  2. Temperature coefficient of resistance should be small
  3. Adhesive force with substrate should be strong enough
  4. Thin-film resistors should feature a stable and reliable performance
  5. Filming should be easy and convenient
  6. Should be capable of handling high-temperature processing, high power and relatively wide application range. 

A Brief Introduction of Embedded PCBs

The first IC invented by Jack Kilby in 1959 contained only two transistors and a resistor. Nowadays, multiple complex techniques are applied to combine tens of millions of transistors into one single PC chip. With electronic products stepping towards miniaturization and multifunction, a type of embedded passive component technology occurred to meet the increasingly higher demands. The ratio between passive components and active components is approximately 20:1, density has been gradually going up with the ratio rising. With so many passive components embedded in PCBs, the area of an SMT circuit board shrinks by 40% compared to board fabricated through embedded technology.

To read this entire article, which appeared in the June 2017 issue of The PCB Design Magazine, click here.

 

Share

Print


Suggested Items

Stephen Chavez and Happy Holden on Designing Reliable Vias

12/02/2020 | I-Connect007 Editorial Team
Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2020 | Andy Shaughnessy, Design007 Magazine
This week, we have quite a potpourri for you. There's good news about the PCB market. And as this year continues to surprise us at every turn, companies are discovering the true nature of their leaders. Todd Kolmodin has a great column about bosses and leaders and why the two words are not synonymous. Not to be outdone, columnist Barry Olney found a way to explain the wavelength of electromagnetic energy by using a chocolate bar and a microwave oven. We also have great articles by Sagi Reuven and Pete Starkey.

Book Excerpt: Producing the Perfect Data Package

06/03/2020 | I-Connect007 Editorial Team
The following is an excerpt from Chapter 1 of Mark Thompson's I-Connect007 eBook "The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package." Mark is in engineering support at Prototron Circuits and a Design007 columnist.



Copyright © 2020 I-Connect007. All rights reserved.