MacDermid Enthone Electronics Solutions Releases Affinity ENIG 2.0
May 4, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the Affinity ENIG 2.0 process, a high reliability, low variation electroless nickel immersion gold plating process. Affinity ENIG 2.0 meets the stringent reliability requirements while also providing significant cost benefits to our customers.
Evolved from a combination of the best technologies of our legacy companies and developed using strict six-sigma process methodology, Affinity ENIG 2.0 is the next generation ENIG process from MacDermid Enthone Electronics Solutions. The ability of Affinity 2.0 to provide excellent solderability, uniformity, and reduced waste, including gold consumption, while adhering to all IPC finish requirements makes it a natural choice for PCB fabricators manufacturing for automotive and telecommunications OEMs. Moreover, Affinity 2.0 is able to deliver process consistency so every pad is the same.
John Swanson, Director of Final Finishes, MacDermid Enthone, noted, “The Affinity 2.0 development represents an excellent example of the combined skills and potential of our recently joined companies. Affinity 2.0 brings our customers best in class ENIG reliability, most notably through unmatched nickel corrosion performance and superior gold metal distribution. We look forward to demonstrating the cost and reliability value of Affinity to PCB fabricators, assemblers, and end users throughout this year.“
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there.
For more information, click here.
Suggested Items
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
The Many Complexities of PFAS
03/26/2024 | Marcy LaRont, PCB007 MagazineIn its simplest definition, PFAS is a group of chemicals used to make fluoropolymer coatings and products that resist heat, oil, stains, grease, and water. Fluoropolymer coatings can be in a variety of products. Though this definition is not inaccurate, it can be misleading. Depending on who you ask, there are upward of 10,000 PFAS chemistries that can meet various definitions.