Paul Rooke Joins Plexus' Board of Directors

Reading time ( words)

Plexus Corp.'s Board of Directors has increased its size to 10 directors and has elected Paul A. Rooke to fill the new seat, effective immediately.

Rooke most recently served as chairman and CEO of Lexmark International Inc., a provider of document imaging and enterprise software solutions, from 2011 until 2016. Rooke also served as CEO of Lexmark from 2010 until 2011.  Prior thereto, he held several leadership positions at Lexmark with increasing responsibility.

Dean Foate, Executive Chairman of the Board, commented, “I am pleased to welcome Paul to Plexus’ Board of Directors. He is an accomplished executive with a diverse background and global expertise. Paul’s experience with strategically transforming organizations to drive growth makes him a highly-qualified addition to our Board.  Paul will strengthen our team of directors and provide management valuable insight as they continue to focus on delivering profitable growth.”

Rooke holds a Master of Business Administration degree from the University of Kentucky and a Bachelor of Science degree in Mechanical Engineering from the University of Michigan.

About Plexus

Plexus Corp. ( delivers optimized Product Realization solutions through a unique Product Realization Value Stream service model. This customer-focused services model seamlessly integrates innovative product conceptualization, design, commercialization, manufacturing, fulfillment and sustaining services to deliver comprehensive end-to-end solutions for customers in the America, European and Asia-Pacific regions.

Plexus is the industry leader in servicing mid-to-low volume, higher complexity customer programs characterized by unique flexibility, technology, quality and regulatory requirements. Award-winning customer service is provided to over 140 branded product companies in the Healthcare/Life Sciences, Industrial/Commercial, Communications and Defense/Security/Aerospace market sectors.


Warning: array_rand(): Second argument has to be between 1 and the number of elements in the array in /home/iconnect/releases/20160311/public_html/elements/next_item.php on line 41

Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Tips & Tricks: Generating Stencil Tooling

12/13/2017 | Ken Horky, Peterson Manufacturing
Many engineers are leaving the editing up to the stencil fabricator these days. From the outside, this may appear as a time saver for process engineers, but considering how many stencil redos have been required and how many processes that have run 'sort of OK,' there's a tremendous amount of scrap and rework that could be saved from just a little more attention paid to stencil tooling.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Copyright © 2017 I-Connect007. All rights reserved.