BAE Systems Reveals Handheld Cognitive Electronic Warfare Technology for DARPA
September 27, 2016 | Business WireEstimated reading time: 1 minute
Through a contract from the U.S. Defense Advanced Research Projects Agency (DARPA), BAE Systems has developed a new lightweight, handheld tactical sensor that soldiers can easily carry and use to better understand radio frequency (RF) signals for enhanced situational awareness.
By using cognitive processing algorithms, this handheld electronic warfare (EW) technology can quickly detect and identify multiple interfering signals, such as jammers or enemy communication signals, across a wide spectrum and in changing and challenging environments. The new capability can be leveraged across multiple platforms and can integrate, for example, into a variety of EW, SIGINT, and signal receiver and communication systems, both large and small.
“By drastically reducing the size, weight, and power of this new cognitive EW system, we’re making it easier for our warfighters to be aware of, classify, and manage a wide range of signals in the battlespace, which is crucial for tactical situational awareness,” said Joshua Niedzwiecki, director of Sensor Processing and Exploitation at BAE Systems. “Better situational awareness on the battlefield means superior protection for our troops and a greater ability to defeat hostile threats.”
The technology was developed under DARPA’s Computational Leverage Against Surveillance Systems (CLASS) program and the Cognitive radio Low-energy signal Analysis Sensor ICs (CLASIC) program. This new handheld EW capability improves on today’s portable spectrum analyzers, which are often bulky, power hungry, and unable to handle interference or classify the signals they detect. Using advanced signal processing algorithms, BAE Systems radically reduced the time and the computing power needed to process detected signals to such an extent that the new system uses only one low-power chip. The result is a 10-times reduction in size, weight, and power compared to conventional spectrum analyzers.
During recent field tests, the new technology successfully detected and identified more than 10 signal types across a wide bandwidth in the presence of interference. The company expects to continue to mature this technology for eventual deployment within its EW, SIGINT, and tactical communications portfolios.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).