Stadium Sets Up New High-tech Manufacturing Facility in China
March 9, 2016 | Stadium Group PlcEstimated reading time: 1 minute
Stadium Group plc has officially opened its new high-tech manufacturing and electronics assembly facility at the Zhengwei Science Park in Dongkeng, near Dongguan, in southern China. The modern site offers upgraded operations that boast leading-edge infrastructure and technology.
Stadium also set up dedicated production capabilities within the factory to support the growing demand for its power products and wireless devices.
Spread across a 12,000sqm site, the new facility has four surface-mount production lines that can handle small-pitch micro-BGA ICs and miniature 0201-sized and odd-form components with in-line automated optical inspection (AOI), as well as through-hole assembly lines and lead-free wave soldering. The site offers medium- to high-volume capability including a chip-placement capacity of >6 million devices per day. The site also has an EMC chamber along with functional and in-circuit test capabilities, as well as equipment for automatic conformal coating and 24 injection moulding machines up to 450 tonnes.
The new facility has been in operation since July 2015, following the group’s decision to move its Asia operations from its previous manufacturing site in China after 15 successful years at a site near to the new facility. Due to meticulous planning and preparation, primarily carried out by the local team in China, the move was accomplished in just three weeks and disruption to customer orders was avoided.
Since the move, the facility has received continual enhancements with significant investments in manufacturing, design and test equipment, and personnel , as well as ensuring that the site is fully compliant with all health, safety and environmental approvals, and also meeting the requirements and receiving recertification for ISO 9001, ISO 14001, ISO 13485 (medical devices) and TS 16949 (automotive) quality standards.
“This new facility is a key component of our global strategy to build a leading design-led electronic technology solutions business with regional centers of excellence,” said Charlie Peppiatt, CEO of Stadium Group. “With increasing demand for our wireless and power solutions, we require additional manufacturing capacity with upgraded equipment and capabilities to build ever-more complex and sophisticated products for our existing and new customers”
“Deployment of the latest manufacturing technologies and improved infrastructure make this a truly world-class facility,” said Sohan Singh, managing director of Stadium Asia. “Additionally, the move to the new site has meant we are better placed to attract and retain talent to support our growth plans, as well as being located in a greener environment and therefore providing improved working conditions for our people.”
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.