Fujitsu, NEC Significantly Improve Efficiency of Base Station Interoperability Testing for the Post-5G Era
July 12, 2023 | JCN NewswireEstimated reading time: 1 minute
As part of the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems" under the New Energy and Industrial Technology Development Organization (NEDO), NEC Corporation (NEC) and Fujitsu Limited (Fujitsu) are conducting research and development of a technology for testing the interoperability of post-5G base stations compliant with O-RAN specifications. A connectivity testing environment using this technology was constructed at NEC's U.K. laboratories and Fujitsu's U.S. laboratories, and tests were conducted from August 2021 to June 2023. By automating the end-to-end process of extracting optimal test scenarios, generating parameters, and determining acceptability of test results, the two companies have succeeded in significantly improving efficiency. The interoperability testing time for base stations of different vendors was reduced by more than 30%, assuming the commercial environment of overseas telecommunications carriers (operators).
Going forward, the two companies will utilize the testing technology developed in this project for joint testing with operators and base station equipment vendors in Japan and overseas to shorten the time required to deploy systems that combine O-RAN compliant base station equipment from different vendors. They will aim to contribute to the revitalization of the telecommunications infrastructure market by supporting the global spread and development of open 5G networks.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.