Keysight Radio Frequency Device Model Generator Adopted by Samsung Foundry
June 27, 2023 | Business WireEstimated reading time: 2 minutes
Keysight Technologies, Inc. announces that Samsung Foundry has adopted the new Keysight IC-CAP Model Generator (MG) to accelerate the creation of circuit libraries, a key component of process design kits (PDKs) for Samsung’s advanced radio frequency (RF) semiconductor process technologies.
Modeling today’s industry-standard RF fin field-effect transistors (FinFET) is a complex and time-consuming process involving massive amounts of data. With the IC-CAP MG software framework, Samsung’s RF modeling engineers can efficiently organize large volumes of data to save time extracting transistor models. The MG handles data management and all the details of simulating and displaying multi-device simulations, leaving engineers free to focus on creating and automating custom flows.
Built on Python 3, the MG software is part of Keysight’s flagship modeling platform, PathWave Device Modeling (IC-CAP). The software imports and organizes measured data and circuit netlists for various geometries and temperatures. In addition, the software automatically creates and efficiently simulates RF trend plots of key figures of merit based on user input.
All data, including trend plots, is available to build custom extraction flows through an intuitive and easy-to-use interface. The product enables efficient simulation and real-time tuning of multi-devices with complex RF sub-circuits, including netlists using layout parasitic extraction files. The MG software framework includes model verification and report generation.
Jongwook Kye, Executive Vice President and Head of Foundry Design Platform Development at Samsung Electronics, said: “Over the past few years, we have been collaborating closely with Keysight EDA to improve the efficiency and accuracy of our RF modeling flow. By adopting the Model Generator in our workflow, our efficiency has improved by at least 30 percent. The Model Generator’s ability to handle complex netlists and the variety of measured data, including S-parameters and low and high-frequency noise, is critical to us. The flexibility and powerful performance of this tool helps improve the accuracy of models. We can customize the parameters thanks to Python and adapt the Model Generator to our needs.”
Niels Faché, Vice President and General Manager, Keysight EDA, said: “The modeling of today’s RF FinFET and tomorrow’s innovative devices is hugely complex and time-consuming. Engineers must extract hundreds of parameters to accurately model the RF behavior of devices for different sizes and temperatures. The Model Generator removes critical barriers in the workflow and allows Samsung engineers to focus more on the modeling and less on the programming. We are pleased that this new solution helps Samsung better manage their modeling workflow, shorten process design kits development cycle, and accelerate product time to market.”
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: