Nanusens Secures First IP License for MEMS-in-ASICs Sensor Technology
June 15, 2023 | NanusensEstimated reading time: 1 minute
Nanusens, a fabless semiconductor company supplying novel MEMS sensors built inside CMOS, has announced the first IP license agreement for its MEMS-in-ASICs technology with Azoteq, a pioneer in high volume sensor fusion ICs used in industrial and consumer applications.
Nanusens technology enables its MEMS (Micro Electro Mechanical Systems) IP sensor structures to be made at the same time within a chip as other IP on the ASIC using standard CMOS processes, resulting in ASICs with embedded MEMS sensors. This breakthrough of the integration of sensor solutions as IP blocks offers dramatic reductions in costs and size as it completely replaces the current solution of discrete sensor packages.
Dr Josep Montanyà, CEO of Nanusens, said, “Azoteq is one of a number of companies that recently received samples of our 3D accelerometer that were created using an IP block within an ASIC. Azoteq is the first to sign an IP license and we plan to announce several more license deals soon.”
Dr Dieter Mellet, Azoteq’s CTO, commented, “Our business is based on creating multi-sensor solutions for customers who often need to include many sensors into space-constrained applications. Nanusens technology enables monolithic integration of MEMS within an IC and is perfect for us as we can now embed an array of 3D accelerometers into an existing IC, providing cost, power and space saving to our customers over current solutions available today further expanding our ProxFusion® offering.”
Suggested Items
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.