Raytheon Technologies Awarded $237 Million Counter-UAS Contract
April 24, 2023 | Raytheon TechnologiesEstimated reading time: 1 minute
Raytheon Technologies was awarded a $237 million U.S. Army contract for Ku-band Radio Frequency Sensors (KuRFS) and Coyote® effectors to detect and defeat unmanned aircraft.
The contract includes a combination of fixed-site and mobile systems as well as a quantity of effectors, designated to support the Army's U.S Central Command operations.
As part of the U.S. Army's Low, slow, small-unmanned aircraft Integrated Defeat System, called LIDS, KuRFS provides advanced 360-degree threat detection, while Coyote low-cost effectors defeat drones.
"The KuRFS radar and Coyote effectors effectively detect and defeat unmanned aircraft systems, an increasingly evident and global threat," said Tom Laliberty president of Land Warfare & Air Defense at Raytheon Missiles & Defense. "LIDS is operationally deployed, providing a proven, reliable, and essential layer of defense against enemy drones."
KuRFS precision targeting radar and the scaled Ku720 mobile sensing radar deliver persistent detection, identification and tracking of airborne threats. The Coyote Block 2 defeats single drones and swarms varying in size and maneuverability, and at higher altitudes and longer ranges than similar class systems.
The U.S. Army's LIDS integrates KuRFS and the Coyote family of effectors with Northrop Grumman's Forward Area Air Defense Command and Control system, or FAADC2, and Syracuse Research Corporation's electronic warfare system. Together, these systems create a multi-mission fixed, relocatable, or mobile deployed system that provides a complete extended-range defense solution.
Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.