SEMI North America Advisory Board Welcomes New Members from Brewer Science, KLA and Nordson
November 21, 2022 | SEMIEstimated reading time: 2 minutes
SEMI announced the election of three new members to the SEMI North America Advisory Board (NAAB): Dr. Sri Kommu, Executive Vice President and Chief Operating Officer at Brewer Science; Neeraj Khanna, Group Vice President at KLA; and Srinivas Subramanian, Executive Vice President at Nordson Corporation.
The Board appointments took effect Oct. 18, 2022. Members serve a three-year term. The SEMI NAAB is the principal advocate for member companies located in North America. Additionally, the Board provides guidance on SEMI Americas programs designed to advance the business interests of member companies and address significant challenges in the electronics manufacturing and design supply chain.
“On behalf of the NAAB, we welcome Dr. Sri Kommu, Neeraj Khanna and Dr. Srinivas Srini Subramanian,” said Scott Balageur, Vice President of Global Business Development for the Edwards Vacuum North American Semiconductor Division and NAAB Chair. “The new Board members boast more than 75 years of combined industry experience. I’m confident that all three will make valuable contributions to the ongoing success of SEMI member companies in North America as the region sees unprecedented investment and is poised to seize significant opportunities across automotive electronics, electronic communications, data management and manufacturing end markets.”
As Executive Vice President and Chief Operating Officer at Brewer Science, Dr. Srikanth (Sri) Kommu leads the company’s semiconductor lithography materials, packaging solutions, and smart devices businesses. Prior to joining Brewer Science, Kommu served as Chief Technology Officer and Senior Vice President at SunEdison Semiconductor. Kommu has over 25 years of experience in the semiconductor industry. He has doctorate and master's degrees in chemical engineering from Washington University and a bachelor's degree in chemical engineering from the Indian Institute of Technology (BHU). He also completed the General Management Program from Harvard Business school and has served as an advisory board member at Washington University since 2012.
As Vice President of Semiconductor Process Control at KLA, Neeraj Khanna oversees customer engagement and strategic marketing. Khanna is a materials engineer with over 20 years’ experience in engineering, marketing, and product management. He holds an MBA from Duke University, a master’s degree in Material Science from the University of Tennessee and a bachelor’s degree from Indian Institute of Technology, Roorkee.
As Executive Vice President of Advanced Technology Solutions at Nordson Corporation, Dr. Srinivas (Srini) Subramanian is responsible for the company’s global electronics product portfolio including electronic process equipment and test and inspection offerings. He previously led Nordson’s advanced fluid dispensing industrial business. Subramanian has more than 25 years of industry experience in technology development, mergers and acquisitions, and management. He holds a doctorate in chemical engineering from the University of Akron and an MBA from Case Western Reserve University.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).