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Real Time with…. IPC APEX EXPO 2024: Innovation and Collaboration at EPTAC

05/06/2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and EPTAC Vice President Leo Lambert discuss the partnership between EPTAC and Blackfox, their program alignment, and future expansion plans. Leo introduces Burak Gokmen as the new "leader of the pack." The focus then shifts to Nano Dimensions' 3D printed circuit boards, emphasizing the need for proper documentation and training.

The New Industry: Will the Growth Continue?

04/30/2024 | I-Connect007 Editorial Team
How sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.

Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia

04/25/2024 | Taiyo Circuit Automation
Taiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.

Determining the Value-add of Box Build

04/24/2024 | Nolan Johnson, I-Connect007
At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.

Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2

04/24/2024 | Vern Solberg -- Column: Designer's Notebook
The printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
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