DARPA Announces ERI Summit 2019 Workshops
June 3, 2019 | DARPAEstimated reading time: 2 minutes
For the second year in a row, DARPA is convening the electronics community to discuss the ambitions and achievements of its five-year, upwards of $1.5 billion investment in U.S. microelectronics advancement. Attendees at the second annual Electronics Resurgence Initiative (ERI) Summit – being held July 15-17 in Detroit, Michigan – will hear from commercial and defense leaders as they share their insights on the domestic semiconductor industry and the applications driving next-generation electronics. The Summit will close on July 17 with 11 public workshops designed to demonstrate program accomplishments, shape future areas of research, and provide insights into working with DARPA as well as transitioning technologies to use.
“Continued collaboration across industry, defense, and academia is critical to creating the next wave of microelectronics innovation,” said Dr. Mark Rosker, director of DARPA’s Microsystems Technology Office (MTO). “Last year’s Summit allowed these groups to come together and collectively work towards creating a more specialized, secure, heavily automated, and DoD-available electronics industry. This collaboration contributed to the formation of six new DARPA programs. With this year’s expanded roster of workshops, we are again asking the community to share their perspectives, provide guidance, and foster the connections that will help define the future of an innovative and competitive domestic electronics enterprise.”
In areas ranging from security and privacy to rapid circuit design, ERI’s programs are already working to address both commercial and manufacturing realities as well as the needs of the defense enterprise. Several “Ongoing Efforts” workshops will provide updates on these active research efforts, including presentations on secure hardware and software architectures for high-risk transactions; trusted-by-design components and their impact on supply chain security; and novel atomic clock architectures. Attendees will also experience live demonstrations of autonomous chip design tools as well as open source IP and verification technology in development on two ERI programs – IDEA and POSH. Both programs are addressing the complexity and cost barriers that have limited the competitive field for circuit design by exploring novel approaches to automated circuit design and IP sharing.
Shaping the future of microelectronics innovation requires research and development across a vast number of technical areas and applications. Several “Emerging Concepts” workshops will explore potential future areas of investment, and will seek input from the community to help define the most critical challenges to address. These workshops will focus on enhanced security for commercial hardware; energy-efficient computing for distributed machine intelligence; and novel approaches to designing and verifying distributed systems. A four-hour workshop will also focus on the challenges facing heterogeneous integration – a critical area of exploration for an emerging wave of alternatives to traditional transistor scaling. The workshop will cover problems associated with dense digital integration and mixing silicon with compound semiconductors, as well as potential solutions and paths forward.
Finally, two “Enhancing Collaboration” workshops will provide guidance to attendees who are new to working with DARPA or are interested in transitioning DARPA-funded inventions out of the lab and into the commercial world. During the “DARPA/MTO Collaboration 101” workshop, Rosker will provide both a history of the agency and information about how to work with DARPA in the future.
The deadline to register for the ERI Summit is Monday, June 24, 2019 at 11:59 PM EST. Registration information as well as a full agenda and workshop descriptions are available at www.eri-summit.com. All attendees must register in advance. Workshop headcount limits will be pre-determined based on attendee interest.
Suggested Items
Altus Equips SSTL with Advanced Cleaning Technology for Electronics
05/07/2024 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics manufacturing industry, has announced the successful installation of an advanced PCBA cleaning system at Surrey Satellite Technology Limited (SSTL).
GPV's Handover of Refurbished Factory Building
05/07/2024 | GPVOn 6 May 2024, Bjorn Fiskers, MD at GPV Electronics TH in Thailand and his team were handed the keys to our refurbished factory building, adding another 7,000 sqm to our current 15,000 sqm electronics factory. Our electronics factory in Thailand will comprise of a total of 22,000 sqm.
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.
AT&S Brings High-Tech to the Museumsquartier
05/06/2024 | AT&SAT&S, as a “MQ goes Green” partner, has prepared special highlights for the occasion: Visitors aged eight and above can embark on an interactive journey through the fascinating world of microelectronics.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.