Michael Cole Promoted to President and COO of AirBorn
February 13, 2019 | AirBorn Inc.Estimated reading time: 1 minute
AirBorn Inc., the Texas-based designer and manufacturer of innovative, highly-reliable electronic components, interconnects and value-added manufacturing solutions including printed circuit board and flexible circuit design through assembly, has promoted Michael Cole to president and chief operating officer (COO) of the company.
"Mike has earned this recognition," said Cindy Lewis, chairperson and chief executive officer. "He is an excellent servant leader and has the proven knowledge and skills to help take AirBorn to the next level."
Cole's promotion comes on the heels of a year of record breaking growth for the company.
"It has been a great honor working with the dedicated team of colleagues at AirBorn," Cole said. "This promotion is a direct reflection of their passion for success and willingness to coalesce around change. It is a great time to be a part of AirBorn, and the future opportunities look remarkable."
Cole has more than 30 years' experience in the electronic, connectors and cable assembly marketplace. He joined AirBorn in 2016.
AirBorn employs over 1,500 at locations in Arizona, Massachusetts, Minnesota, Ohio, Pennsylvania and Texas. The company also has operations in Canada and the United Kingdom. Its products can be found on Mars, the depths of space as well as fighter jets, warships and in life-saving medical devices.
Suggested Items
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/01/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.