Ventec at electronica 2018: No Compromises for High-Frequency Materials
November 2, 2018 | Ventec International GroupEstimated reading time: 3 minutes
Ventec International Group will announce the launch of its extended ceramic-filled hydrocarbon thermoset material series designed for the world's most demanding high-frequency printed circuit board applications at this year’s electronica show in Munich. The global Ventec team will also be on hand in hall A1 at booth #468 to present the company’s unique laminate and prepreg capability across a very wide range of applications and budgets under the theme of ‘No more compromises: Price, Performance and Availability.'
From 13-16 November, electronica 2018 will be the global launch platform for Ventec's extended tec speed 20.0 range of ceramic-filled hydrocarbon thermoset material series. Combining unrivalled high-frequency performance (Dk 3.00-3.48/Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec's fully controlled and managed global supply chain and technical support-network, the tec-speed 20.0 series offers excellent dimensional stability and uniform mechanical properties that help limit PIM. With the extended tec speed 20.0 range, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.
Other show highlights include:
Material Showcase
A special product & material showcase will demonstrate PCB material applications including a power module and a LED lighting module that illustrates examples of IMS boards combined with FR4 control boards made with Ventec’s high performance and highly reliable IMS materials like VT-4B5SP, VT-4B5L and VT-4B7. Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.
Announcing European Distribution Agreement for Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, Ventec has teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) to the European market. TIM is a thermally conductive medium used to fill the air gaps between mating surfaces in electronic components. Air is a poor conductor of heat and creates a thermal barrier which stops the transfer of heat between the component and its heatsink or chassis. EMI Thermal’s range of materials distributed through Ventec includes double sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.
With a one-stop-service solution for customers, Ventec also offers further distribution products to the European PCB and electronics industry including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and speciality (Centrum & Glossback) drill materials, copper foils including ACF.
Stock exchange Listing Celebration
Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. To celebrate the successful IPO as well as the launch of its latest product offerings, Ventec is looking forward to hosting show-visitors at its booth party on Wednesday, 14 November from 18:00 to 21:30.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.