Raytheon to Expand Radar Manufacturing in Mississippi
June 5, 2018 | Raytheon CompanyEstimated reading time: 1 minute
Raytheon Company is expanding the footprint of its Forest-based manufacturing center, company and state officials announced today. A new building on the campus will be a hub for test, integration and production of s-band radars—including the U.S. Navy's next generation SPY-6, Air and Missile Defense Radar program.
"Construction of a new radar production facility is the next step in our decades-long partnership with the state of Mississippi and its highly skilled workforce," said Wes Kremer, president of Raytheon's Integrated Defense Systems business. "Together we will integrate, test and deliver the most technologically advanced military radar systems to our U.S. and international customers."
Raytheon is investing $100 million in the new 50,000 square foot Leadership in Environmental Design, or LEED, certified facility that will provide future growth opportunities across the company's diverse product portfolio.
The new radar production facility will bring dozens of jobs to Forest over the next five years – including the potential for future personnel growth – in addition to many dozens of external jobs from the local community in support of the construction, supply and design of the facility.
Governor Phil Bryant said, "Raytheon recognizes the value of continued investment in the state of Mississippi. Together, along with Raytheon's outstanding employees, we will continue supporting the U.S. military and strengthening our national defense through the innovative, high-tech radar systems developed in East Mississippi."
The facility will become the newest addition to Raytheon's existing Consolidated Manufacturing Center campus in Forest, which will continue uninterrupted delivery on critical commitments across the airborne radar and electronic warfare markets.
About Raytheon
Raytheon Company, with 2017 sales of $25 billion and 64,000 employees, is a technology and innovation leader specializing in defense, civil government and cybersecurity solutions. With a history of innovation spanning 96 years, Raytheon provides state-of-the-art electronics, mission systems integration, C5I™ products and services, sensing, effects, and mission support for customers in more than 80 countries.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.