There was a time, not so many decades ago, when that most commonly-stated mantra (“lower labor costs”) behind offshoring printed circuit fab (and some assembly) operations, still had some case-by-case validity.
Against the Density Wall: Landless Vias Might be the Answer, by Happy Holden
Flexible Circuit Fabrication and Cleanroom Manufacturing, by Dave Becker
High-Throw Electroless Copper—New Opportunities for IC Substrates and HDI Manufacturing, from Atotech
IMPACT Washington, D.C. 2016: Interviews and Editor’s Re-cap
The 21st Century PCB Factory—Designed to Eliminate Offshore Cost Advantages, by Alex Stepinski
The Solder Paste Factor in Printing – with Mitch Holtzer Solder Paste Printing: Challenges and Best Practices – with Watson Tseng Solder Jet Printing: Keeping Up with the Challenges – with Thomas Bredin Solder Paste Dispensing: Breaking the Limits of Printing – with Eric Gu SPI Parameter Considerations for Tighter Tolerances – with JM Peallat and CC Hee