Robots can drive on the plains and craters of Mars, but what if we could explore cliffs, polar caps and other hard-to-reach places on the Red Planet and beyond? Designed by engineers at NASA's Jet Propulsion Laboratory in Pasadena, California, a four-limbed robot named LEMUR (Limbed Excursion Mechanical Utility Robot) can scale rock walls, gripping with hundreds of tiny fishhooks in each of its 16 fingers and using artificial intelligence (AI) to find its way around obstacles.
A quotation from The Golden Record 2.0 — a play written for the NUS Arts Festival — and a high-tech quantum device from the NUS Centre for Quantum Technologies (CQT) is now orbiting in space together.
For the most part, working in government relations is like running a marathon, not a sprint. It can take weeks, months, or even years to formulate an industry consensus position, educate the relevant policymakers in legislatures and...
High reliability and compliance are hot topics at conferences all over the world. If you are a supplier to industries like defense, automotive, medical, and aerospace/space, high-reliability and regulatory compliance are strict...
What happens when you have all of the suppliers you need, but a larger firm acquires one of them all of a sudden, and there is only one qualified supplier left when there used to be two. As a smart PCB user, you always want to keep...
Microvias: Links of Faith Are Not Created Equal by Jerry Magera and J.R. Strickland
Interconnect Reliability Correlation With System Design and Transportation Stress by Dr. Paul Wang, et al.
How Changing Cleaning Technologies Affect Reliability An interview with Mike Konrad
A Guide to High-reliability PCBs From Design to Specification by Jeff Beauchamp
Avoiding CAF Failures at the IPC High-reliability Forum An interview with Terry Munson
How to Feed Test Data Back to Engineering for Process Improvement by Todd Kolmodin
Focusing on Surface Sensitivity for Reliability An interview with Elizabeth Kidd and Alex Bien
Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz
Low-temperature SMT Solder Evaluation by Howard “Rusty” Osgood, et al.
Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala
Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee
Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Y. K. Song, V. Bukva, and R. Wong
Welcome to Real Time with… IPC APEX EXPO 2019 Show & Tell by Nolan Johnson
Electronics Industry Comes Together at IPC APEX EXPO 2019 by Dr. John Mitchell
Real Time with… IPC APEX EXPO 2019 Video Showcase and Library
Happy’s Highlights by Happy Holden
Leo Lambert, IPC’s 2019 Hall of Fame Inductee by Patty Goldman
Inspiring the Next Generation of Leaders: IPC STEM Student Outreach Program by Patty Goldman
A STEM Student on FIRST Robotics and Career Opportunities by Barry Matties